Listed twenty three days agoProcess Development Senior/Staff Engineer (Die Bond/Wire Bond)at OSRAM Opto Semiconductors (Malaysia) Sdn BhdThis is a Full time jobBayan Lepas, PenangsubClassification: Process EngineeringProcess Engineeringclassification: Engineering(Engineering)Flexible and Hybrid Working ModeGlobal Collaboration Opportunities on New Exciting ProjectsDiversified, Rewarding & Supportive Workplace23d ago
Listed twenty days ago(Sr. )Engineer, Flip Chip Die Attach/ Underfill Process Developmentat Western DigitalThis is a Full time jobBatu Kawan, PenangsubClassification: Process EngineeringProcess Engineeringclassification: Engineering(Engineering)20d ago