Advertised:14-02-13 | Closing Date:16-03-13

 

NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise.  These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications.  Headquartered in Europe, the company has approximately 28,000 employees working in more than 25 countries and posted sales of USD 4.4 billion in 2010. 
 
Working at NXP is a challenge – the challenge and experience of being part of a dynamic team dealing with cutting edge customer solutions.  As an ambitious team of professionals operating in an incredibly exciting industry, we’re always looking for passionate, talented people who will embrace the freedom and challenges we provide.  Dedicated professionals that actively push back the boundaries beyond what would normally be expected.
 
NXP supports and respects human rights and provides fair & equitable treatment to all employees regardless of  race, age, gender, sexual orientation,  ethnicity, disability, religion, political affiliation, union membership, national origin or marital status. 

Process Development Engineer
Negeri Sembilan - Seremban

Responsibilities:

  • Process knowledge for Assembly area like Package Saw / Die Bonding / Wire Bonding / Trim & Form / Testing
  • Develop use of new technology to achieve cost savings in existing parts.
  • Continue to do self-study to enhance self knowledge in the area of expertise.
  • Involve in resolving factory chronic problems permanently.
  • Sharing knowledge with others via training or any other people development program
  • Set-up, evaluate, and buyoff new equipment and process.
  • Release timely with satisfactory performance to production
  • Coordinate, evaluate and analyze transfer devices in terms design, process workability/definition and manufacturability.
  • Responsible to Transfer Product and coordinate on-site
  • Responsible to ensure all documents for new product release are reviewed, updated and properly documented.
  • Supports new package assessments and follow up experimental during the planning stage for scale-up and technology transfer
  • Encourage, motivate, and develop self and others to optimized knowledge and capability.
  • Responsible for capacity transfer and ramp-up
  • Regular communication with subordinate (if any) to ensure consistent performance.

Requirements:

  • Degree in Material/ Mechanical/ Electrical/ Electronic Engineering, Applied Science or any equivalent engineering discipline .
  • 3-5 years working experiences in semiconductor assembly manufacturing environment.
  •  Has knowledge on Assembly Process and new product development.
  • Has ability to focus in depth to solve problem in his/her area of interest.
  • Ability to meet deadline on project assigned.


Interested candidates please apply online with detailed resume. Only short-listed candidates will be notified.


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NXP Semiconductors Malaysia Sdn. Bhd.
Pt No. 12687, Tuanku Jaafar Industrial Park, Seremban 71450.



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NXP Semiconductors Malaysia Sdn. Bhd. (244835-W)